| Description | Specification |
|---|---|
| Layers | 1 – 48 layers |
| Materials | FR-4,CEM3,TG170, AL based,etc. |
| Maximum Board Size | 550 mm x 710 mm |
| Board Thickness | 0.15 mm – 4.8 mm |
| Minimum Line Width & Gap | 0.075 mm(3mil), normal 0.1mm |
| Minimum Diameter | 0.10 mm, normal 0.2 mm |
| Hole Plating Thickness | >=0.025 mm |
| PTH Hole Dia. Tolerance | 0.075 mm |
| Hole Postion Deviation | 0.05 mm |
| Outline Tolerance | 0.10mm |
| Insulation Resistance | >= 10000000 kohm |
| Through Hole Resistance | <=300 μohm |
| Dielectric Strength | >=1.6 kV/mm |
| Current Breakdown | 10 A |
| Peel-off Strength | 1.5 N/mm |
| Solder Mask Abrasion | >5H |
| Thermal Stress | 260 °C 10sec |
| Surface Finish | HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel/Immersion Gold), Flash Gold, OSP, etc. |
| Inflammability | 94V0 |
| E-Test Voltage | 10-250V |
| Pull of Strength of Peels | >100N |
| Solder Ability | 235 °C |
| Bow and Twist | <0.0075 mm/mm |
| Soldermask Color | Green, Blue, Yellow, Red, Black, White |
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