| Description | Specification |
|---|---|
| Number of Layers | 1 to 12 |
| Thickness Tolerance | ±10% |
| Trace Width | 0.075 mm for 0.5 Oz, 0.1 mm for 1 Oz |
| Trace Width Tolerance | ±10% |
| Smallest Hole Size | 0.2 mm for PTH |
| SMT Pitch | 0.4 mm |
| Lead Time | 1 to 2 Layers – 3 to 5 WKDs |
| Conductor Width Tolerance | 0.025 mm |
| Hole Diameter Tolerance | 0.05 mm |
| Accumulated Pitch Tolerance | 0.05 mm |
| Outline Dimension Tolerance | 0.05 mm |
| Conductors and Outline Tolerance | 0.15 mm |
| Conductors and Coverlay | 0.3 – 0.5 mm |
| Surface Treatment | Ni/Au, Sn/Pb |
| Insulation Resistance | 1000 MW |
| Dielectric Strength | 5 kV |
| Surface Resistance | 5×1012 |
| Volume Resistivity | 1×1015cm |
| Dielectric Constant | 4 |
| Dissipation Factor | 0.04 |
| Peeling Strength (180 irection) | 1.2 kgf/cm |
| Solder Heat Resistance | 1.2 kgf/cm |
| Flammability | 94 V-0 |
| Water Absorption | 2.9% |
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